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Our company name, email addresses, and web address will change as follows: Former Company Name: Distec GmbH Vertrieb von Elektronischen Bauelementen New Company Name: FORTEC Integrated GmbH Former ema
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extensive support for all your projects and if you cannot find what you were looking for - please call us! Downloads Obsolescence Management Technical Support Repair & Return (RMA) Guarantee EOL REACH
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to offer you the right solution for your project. Please contact us at sales@distec.de or give us a call. We will advise you.
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regular basis. Did we pique your interest? If you have any questions, please contact us by e-mail or call your sales contact at Distec.
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Tape Bonding Bonding with double-sided adhesive tape Tape bonding, also called air-gap bonding, involves joining different components together with precisely cut double-sided adhesive tape. It is important
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gains even more stability and robustness. See our demo videos with a dropball test and a water test or call us. We are happy to help you. To the display
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samples for you. Put our VacuBond ® optical bonding process and our touch expertise to the test and call us!
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ATX, Micro-ATX, Flex-ATX and Mini-ITX describes the mounting option and size of a motherboard (also called mainboard). The standardization makes it possible to exchange boards of the same size, possibly even
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solutions with design and development in Germany. Projected capacitive touch screens are usually briefly called PCAP touch screens. They are robust , can be easily equipped with protective glass and feature m
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display that lead to restrictions in the explosion protection certification. This process is also called free air exclusion bonding or void exclusion bonding and works as follows: We dismantle the TFT display
