31.
DDR4-2133 memory sockets. For the connection of external USB devices there are four USB 3.0 ports on the front and two USB 2.0 on the back. On request, we supply the embedded BoxPC with Windows 10 IoT LTSC 2019 [...] applications in demanding environments. This is also supported by the defined operating temperature of 0°C to 45°C. The BoxPC Pro NPA-1904 has many other interfaces : one DisplayPort, two Gigabit Ethernet [...] global industrial use and is equipped with a write filter, among other things. The BoxPC uses a TPM 2.0 chip on the hardware side for drive encryption, thus cyber security is guaranteed. We are happy to advise
32.
4096x2304 pixels, two Gigabit Ethernet ports and two each RS485 and RS232. Four USB 3.0 ports on the front and two USB 2.0 ports on the back are available for connecting external USB devices. Despite its [...] and cost-effective applications in demanding environments , such as automation solutions, Industry 4.0, digital signage and medical technology. In addition to the docking connector, the BoxPC Pro NPA-1904 [...] two DDR4-2133 memory sockets, each equipped with 4 GB (8GB). With a defined operating temperature of 0 to 45°C, the BoxPC is ideally suited for conventional industrial use and features an integrated watchdog
33.
Framework 2.0, 3.0 or 3.5 need to be installed on your PC. *2 If the driver is to be used on Windows XP, use this version if one of .Net Framework 2.0, 3.0, or 3.5 are not installed on your PC. *3 Officially [...] *2 23.04.2014 1.00.31 *2 Filesize: 32MB *2 Linux DMC TSC-Series Linux 32b 64b K3.3 Treiber 11.01.2015 2.1.5 Filesize: 5MB *3 Windows XP, 7, 8, 8.1 DMC TSC-Series DMT-DD WinXP 7 8 8.1 15.02.2019 2.05 Filesize:
34.
4x USB3.0, 2x USB 2.0, 4x COM, 2x SATA III 1x miniPCIe, 1x M.2 (B-key) Bestellinformationen: IB811LF-I50-R3.0A | 3,5" SBC w E3950 LVDS IB811LF-I40-R3.0A | 3,5" SBC w E3940 LVDS IB811LF-I30-R3.0A | 3,5" SBC [...] SBC w E3930 LVDS IB811LF-420-R3.0A | 3,5" SBC w N4200 LVDS IB811LF-335-R3.0A | 3,5" SBC w N3350 LVDS [...] iBase Lüfterloser und kompakter 3,5" SBC von iBASE mit Intel® Apollo Lake CPU N4200 / N3350 / x7-E3950 und x5-E3930 für bis zu -40…+85°C Daten: Bis zu 8GB DDR3L Arbeitsspeicher Unterstützt HDMI(1.4b),
35.
Actuator 3.0 – patented electromagnetic technology for precise tactile feedback Seamless Connectivity The Braille Monitor connects quickly via USB-C (Power & Data) or Bluetooth Low Energy 5.0 – making
36.
4) (DP++) Zweifaches Intel® 2.5G LAN 8x USB 3.1, 2x USB 2.0, 4x SATA 3.0, 4x COM 1x PCI-E(x16) (Gen5.0), 2x PCI-E(x4) (Gen4.0), 1x PCI-E(x1) (Gen3.0), 2x PCI 4x M.2 (B-Schlüssel, E-Schlüssel/ 2x M-Schlüssel) [...] Generation Intel® Core™ i9/i7/i5/i3 / Pentium® / Celeron® mit Intel® R680E/ Q670E PCH Merkmale: 4x DDR4 DIMM, Max.128GB Integrierte Intel® Prozessor-Grafik unterstützt HDMI(2.0b), DVI-D und DisplayPort (1.4) [...] M-Schlüssel) Watchdog-Timer, digitale E/A, iAMT (16.0), TPM (2.0) Bestellinformationen: MBB-1000AF-R | MBB-1000AF-Q |
37.
Generation Intel® Core™ (Tiger Lake UP3) Prozessor SoC Dual non-ECC DDR4 3200 SO-DIMM, unterstützt bis zu 32Gb 4 x HDMI 2.0, unterstützt 4K@60Hz Zwei LAN-Anschlüsse und 3 x USB 3.0-Anschlüsse Onboard M.2 2280 Key [...] Wi-Fi- oder LTE-Module Lüfterloses Design Bestellinformationen: NDiS V1100-i3 | P/N: 10W00110000X0 NDiS V1100-i5 | P/N: 10W00110001X0
38.
ASUS IoT Das Tinker Board 3N von ASUS ist ein 2,5" Pico-ITX Single Board Computer mit Quad-Core ARM Cortex-A55 Prozessor und in den Varianten 3N PLUS, 3N und 3N LITE erhältlich. Merkmale: Unterstützt mehrere [...] -40~85°C 90ME06K1 | 3N/4G/32G | 0~60°C 90ME06K2 | 3N LITE/2G/32G | 0~60°C [...] RS-232/422/485, CAN BUS 2.0 Weiter DC-Leistungsbereich 12V~24V Arbeitstemperturbereich von bis zu -40~85°C Unterstützt Linux Debian 11, Yocto, Android 12 Bestellinformationen: 90ME06K0 | 3N PLUS/4G/32G | -40~85°C
39.
i7/i5/i3 LGA1151 Prozessor mit C246/ Q370/ H310 Chipsatz. Merkmale: 4x DDR4 DIMM, Max.128GB Integrierte Grafik des Intel®-Prozessors unterstützt HDMI(2.0a), DVI-D und DisplayPort 6x USB3.1, 2x USB 2.0, 4x [...] 4x SATA 3.0, 6x COM 1x PCI-E(x16), 1x PCI-E(x8)(Gen3.0), 1x PCI-E(x4), 2x PCI-E(x1), 2x PCI Bestellinformationen: MB997AFS-C246 | C246 MB997AFS | Q370 MB997EFS | H310
40.
DP++, HDMI 2.0 Support 4K @ 60Hz eDP display output Duale LAN-Ports und USB 3.0-Ports für einfachen Anschluss Onboard M.2 2280 Key M (PCIe x4) für Speichermodule Onboard M.2 2230 Key E für optionale W [...] Temperaturen und Anwendungen im Freien Bestellinformation: X200-i5 | (P/N: 10W10X20000X0) X200-i3 | (P/N: 10W10X20002X0) [...] Nexcom Nexcom 3.5” Single Board Computer mit 11th Gen. Intel® Core™ Rocket Lake Prozessor Features: 11th Generation Intel® Core™ processor SoC 3.5” embedded form factor Dual 4K @ 60Hz display output, DP++
