conga-HPC/mIQ-X
COM-HPC Modul | Qualcomm® Dragonwing™ IQ-X series
COM-HPC Mini Size High-Performance Module | based on Qualcomm® Dragonwing™ IQ-X | an exciting, high-performance alternative to Intel that combines multi-OS flexibility with Android, Windows, and Linux
Features:
- First high-performance ARM on COM-HPC Mini
- Up to 12 Qualcomm® Oryon CPU cores
- Qualcomm® Hexagon NPU with 45 TOPS
- High performance Qualcomm® Adreno GPU
- PCI Express Gen 4 | USB 4
- Industrial Temperature Range -40°C to +85°C
Ordering information:
conga-HPC/mIQ-X7-64G UFS128 | 053100
conga-HPC/mIQ-X7-32G UFS128 | 053101
conga-HPC/mIQ-X7-16G UFS128 | 053102
conga-HPC/mIQ-X5-32G UFS128 | 053106
conga-HPC/mIQ-X5-16G UFS128 | 053107
Technical Data
Manufacturer
congatec
Product Series
Computer-on-Module
Product Category
Special SOM
CPU Type
Qualcomm® Dragonwing™
CPU
- Qualcomm® Dragonwing™ IQ-X7 with 12 cores up to 3.4GHz
- Qualcomm® Dragonwing™ IQ-X7 with 8 cores up to 3.4GHz
Memory
up to 64GB soldered down LPDDR5x
Temperature Range Top
-40...+85°C
Temperature Range Tst
-40...+85°C
Interfaces
I²C
USB 2.0
GPIO
UART
PCIe
SMBus
USB 3.2
eSPI
USB 4.0
CAN
GP SPI
4-lane CSI
